Thermal Solutions

Bridge Semiconductor Corporation

www.bridgesemiconductor.com

Solutions: Thermal Solutions
Special Subjects: Thermal management substrates
Business Volume: medium / high

Contact APAC
William Pan Jerry Tan
3F , 157 Li-Te Road, Peitou District
11259 Taipei
Taiwan
Tel: +886 2 2896 9568
Fax: +886 2 2896 9567
williampan@
bridgesemiconductor.com


Founded in 2000, Bridge is an electronic packaging solution provider headquartered in Taipei with a subsidiary in Singapore. Bridge offers many advantageous thermal, electrical and reliability solutions through a multi-layer copper interposer-SuperMCPCB

Bridge key value proposition is to provide innovative designs as well as low cost manufacturing technologies to meet the stringent thermal and electrical requirements of LED and semiconductor devices. What separates it from the competition is the company`s emphasis on both innovation and low cost.

With the company`s healthy growth of IP portfolio to more than 100 granted patents, the management believes it has a stronghold on various unique substrate and packaging architecture to deliver specific performance and functionalities at low cost.

At Bridge Semiconductor Corporation, we focus on developing technologies and solutions to better address thermal and form-factor stringent requirements. Currently, our core products include:

(1) CoreBoard (SuperMCPCB) for LED modules
(2) Metal substrate (SuperMS) for LED packaging

SuperMCPCB addresses the most challenging thermal issues by integrating metal posts in the multi-layer PCB to provide an effective electrical and thermal solution for LED applications. Compared with conventional MCPCB structure using thermally conductive adhesives, this embedded-post design enables many benefits including assured long-term reliability, higher design flexibility and improved optical performances. SuperMCPCB can be designed with COB or SMT formats.