Thermal Solutions

Denka Co., Ltd.

Solutions: Thermal Solutions
Special Subjects: Thermal management substrates / Thermal interface materials
Business Volume: medium

Contact APAC
Minoru Matsumoto
Denka Co., Ltd.
Nihombashi Mitsui Tower
103-8338 Tokyo, Nihombashi Muromachi 2-chome, Chuo-ku
Tel: +81 352 905 445
Fax: +81 352 905 289
Contact EU
Keita Kishimoto
Denka Chemicals GmbH
40211 Düsseldorf
Tel: +49 211 130 9950
Fax: +49 211 329 942

DENKA (Denka Co., Ltd.) produce various kind of thermally conductive materials which utilize proprietary ceramics fine powder technologie (AlN, SiO2, Al2O3, BN, Si3N4).

* High thermally conductive Insulated Metal Substrate (IMS) which has 2, 4, 8 W/mk of thermal conductivity for isolation layer.
* Flexible-IMS
* Thermally conductive sheet / spacer (gap filler) with or without adhesive on single or both side
* Thermally conductive paste and phase change materials up to 8 W/mk of thermal conductivity
* Thermally conductive adhesive.